BGA IC Adhesive Removing Liquid
For sale: other appliances, electronics, appliances in Nigeria
You are buying a bottle of 30ml BGA IC Adhesive Removing Liquid.
It can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.And it won't do harm to your circuit board and components.
This is a environment friendly item and it's very safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.
How to use:
Step 1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.
Step 2. Place a plastic bag or film on the top and cover the PCB board.
Step 3. Wait approx. 20 minutes
Step 4. Redo step 1 to step 3.
Step 5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.
Step 6, Heat up the chip with a air gun (300 deg.C). The glue in the bottom will get melt and soften by heat;
Step 7. To remove the chip with a tweezers or cutter.
This glue removing liquid shall not touch skin, eyes. Please close it after using. If touched by accident, Please wash with water immediately.Address: GoodTry Room 510, CBC tower 5th floor, Lekki Phase I